Aim of the Conference:
    to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products. Topics of the conference include, but are not limited to:

    Integrated Systems Design:
    • SOC, SIP design

    • Multiprocessor systems
    • Embedded systems
    • Wireless systems
    • Network on Chip
    • Analog, Mixed Signal and RF systems
    • MEMS and MOEMS systems
    • Low Voltage and Low Power systems
    • Innovative technologies
    • Synthesis (physical, logic)
    • Simulation, Validation and Verification
    • 3D integration
    • Hardware Security

    Integrated Systems Technology:
    • Nanoelecronics
    • Device Modeling
    • Material Characterization
    • Failure Analysis
    • New Components
    • Packaging
    • Process Technology
    • Reliability Issues
    • 3D Integration

    Integrated Systems Testing:
    • Defect and Fault Modeling
    • Analog and Mixed Signal Testing
    • MEMS/MOEMS Testing
    • SOC and SIP Testing
    • Delay Testing
    • Memory Testing
    • Fault Simulation, ATPG
    • DFT, BIST, BISR
    • On-line Testing
    • Fault Tolerant Systems
    • ATE Issues
    • Alternative Test Strategies
    • 3D Testing
    • Test and Security Issues

      🔗News!🔗

    • New Wednesday’s program uploaded here

    Social event info

    Preliminary program uploaded
    Camera ready preparation
    Hotel reservation info
    Registration info update
    • 🏝️ How to get here 🏝️
    Key Dates:
    Paper Submission: February 3, 2019
    Notification: February 28, 2019
    Camera Ready: March 25, 2019

    You can find the Call for Papers here.

    Paper Submission:
    You can submit your paper here.

                          General Chairs:
    Ioannis Voyiatzis                 Michel Renovell
    UniWA, Greece                     LIRMM, France
                                             

    Program Chair:
    Elena-Ioana Vatajelu
    TIMA, France
     

    Program Vice-Chair:
    Udo Schwalke
    IHTN, Germany

    Sponsors